Odin Heavy Industries is committed to helping the advancement of technology in the electronic and semiconductor markets. OHI understands the needs of the semiconductor industry, such as high purity, chemical resistance, and low permeation polymers. Leveraging our design and material expertise, we partner with OEMs to provide polymer solutions and manufactured products for critical applications.
Engineered Sealing Solutions
Door Seals, Bonded Slit Valve Door Seals, Over Molding, Wafer Seals, Spring Energized Seals, Dovetail Seals, High Purity Seals, & Vacuum Seals.
FAB Equipment Components, Wafer Carriers, CMP Retainer Rings, Structural Components, Chemical Resistant Coatings & Liners, Polymer Analytical Components, Polymer Valves Components, Polymer Fitting Components, Polymer Pump Components, High Purity molded & Machined Filter Components, High Purity molded & Machined Heater Components, Custom Polymer Assemblies, Polymer Welding & Bonding, Fluoropolymers Components for Filters & Heating Equipment, and High Purity Material Stock Shapes.
Wafer Mounting & Die Cutting.
Die Attachment, IC Bonding (Wire bonding, Thermosonic bonding, Flip chip, Wafer bonding, & Tab bonding).
Baking, Plating, Lasermarking, Trim and form.
Wet cleans, Photolithography, Ion implantation, Dry etching, Wet etching, Plasma ashing, Thermal treatments (Including Rapid thermal anneal, Furnace anneals, & Thermal oxidation), Chemical vapor deposition (CVD), Physical vapor deposition (PVD), Molecular beam epitaxy (MBE), Electrochemical deposition (ECD), Chemical-mechanical planarization (CMP), Wafer testing, & Wafer backgrinding.